Products

Pastes for Flexible Circuitry



Pates for FPC/Membrane Switch
Product No. Filler Type Resitivity (mW/mil) Flexibility (Bending times) Curing Temp. Curing Time (Min.)
AT-3040Y Ag <13 ≧10 150℃ 30
AT-3050 Ag <12 ≧6 150℃ 30
AT-3060 Ag <11 ≧10 150℃ 30
AT-3202A Carbon black <50 (W/mil) 150℃ 30

Pastes for Blood Glucose Test Strips
Product No. Filler Type Resitivity (mW/mil) Curing Temp. Curing Time (Min.) Features
AT-3050 Ag <13 150℃ 30 Thermoplastic Resin System
AT-3109G Ag/C <30 130℃ 30 Thermosetting Resin System
AT-3109GA Ag/C <35 130℃ 30 Thermosetting Resin System
AT-3109GL Ag/C <20 120-125℃ 30 Thermosetting Resin System
BT-6025B Ag/C <22 110-120℃ 30 Thermosetting Resin System

Paste for EMI Shielding
Product No. Filler Type Resitivity (mW/mil) Curing Temp. Curing Time (Min.) Features
AT-3112A Ag/C <30 150℃ 30 Thermosetting Resin System

Pates for RFID Antenna
Product No. Filler Type Resitivity (mW/mil) Curing Temp. Curing Time (Min.) Abrasion Resistance
(Anti-abrasion Times)
AT-3109RF Ag/C <40 130℃ 30 Thermosetting Resin System

Marking Pastes
Product No. Color Solid% Curing Temp. Features
AC-2000 Purple 100℃ Organic type; No residue after burn-out
DE-2670H Black 180℃ G2 for CR; Curing Type; One Part
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